suiningxiaohh
锡条: SOLDE BAR锡膏: SOLDER PASTE锡炉: SOLDER-POT浸锡: DIG-SOLDER焊点: SOLDERING JOINTS焊盘: PAD/LAND 焊接: WELDING超声波焊接: ULTRASONIC WELDING回流焊接: REFLOW SOLDERING 波峰焊接: WAVE SOLDERING回焊前: PRE-REFLOW回焊后: POST-REFLOW回流炉: REFLOW OVEN虚焊: DEWETTING 假焊: SHORT SOLDER少锡: INSUFFICENT SOLDER偏位: MISALIGNMENT阻焊剂: SOLDER-THIEF/MASK线路: TRACE回路: CIRCUIT短路: BRIGING/SHORT 线路开路: BROKEN TRACE 线路板; PCB(Printed Circuit Board)线路板装配: PCBA( PRINTED CIRCUIT BOARD ASSEMBLY)集成电路:IC( INTERGRATED CIRCUIT)ESD: ELECTROSTATIC DISCHARGE: 静电放电ESD PREVENTION&DAMAGE: 静电防护与损坏FMEA: FAILURE MODE AND EFFECT ANALYSIS(失效模式分析)SPC: STASTICAL PROCESS CONTROL(统计过程控制)IPC: INSTITUTE OF PACKING AND INTERCONNECTS(电子电路互连与封装协会)正极: ANODE END负极: CATHODE END硬化: CURING配线: WIRING冷却硬化: OVEN-CURING间距: PITCH周期: CIRCLE TIME测试: DEBUG模拟: SIMULATION 毛细管现象: CAPILLARY ACTION导体: CONDUCTIVE PATTERN介质材料: DIELETRIC MATERIAL镀通孔: PTH( PLATED THROUGH HOLE) 额定电源: RATED POWER氧化: OXIDE 烘干: BAKE紫外线: ULTRAVIOLET线圈: WINDING涂层: COATING溶剂: SOVENT隔热板: FELT不合格品: NONCONFIRMING UNITS原料: DIRECT MATERIAL辅料: INDIRECT MATERIAL试产: PILOT PRODUCTION量产: MASS PRODUCTIONX 光测试: X RAY TEST跌打测试: DROP TEST老化测试: BURN-IN TEST振动测试: VIBRATION TEST丝印: SPRAY-PAITING烫金: METAL-STAMPING注塑: INJECTION MOLDING
哇靠哇塞
main materials or components 主材indirect materials such as alcohol or packing material辅材，间接物料，如酒精，纸箱类
